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  Datasheet File OCR Text:
 DF005 THRU DF10
GLASS PASSIVATED CHIP SINGLE-PHASE BRIDGE RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere
Features
Ideal for printed circuit board Glass passivated chip junction High temperature soldering guaranteed: 260 /10 seconds at 5 lbs tension
Mechanical Data
Terminals: Plated leads, solderable per MIL-STD-202, method 208 Case: Molded with UL-94Class V-0 recognized flame retartant epoxy Polarity: Polarity symbol marked on body Mounting Position: Any
Maximum Ratings and Electrical Characteristics
Single-phase, half-wave, 60Hz, resistive or inductive load. Ratings at 25 unless otherwise stated. For capacitive load, Derate current by 20%.
Characteristic
Symbols
DF005
DF01
DF02
DF04
DF06
DF08
DF10
Units
Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TA=40 Peak forward surge current 8.3mS single half sine-wave superimposed on rated load Maximum forward voltage at forward current perelement 1.0A I t-rating for fusion (t<8.3mS)
2
VRRM VRMS VDC I(AV) IFSM VF It
2
50 35 50
100 70 100
200 140 200
400 280 400 1.0 50.0 1.1 10.0 10.0 500.0 25.0 40.0 -55 to +125 -55 to +150
600 420 600
800 560 800
1000 700 1000
Volts Volts Volts Amp Amps Volts A 2S A F /W
Maximum DC reverse current at rated DC blocking voltage Typical junction capacitance (Note 1) Typical thermal resistance (Note 2) Operating temperature range Storage temperature range
TA=25 TA=125
IR CJ R
JA
TJ TSTG
Notes: (1) Measured at 1.0MHz and applied reverse voltage of 4.0 VDC (2) Thermal resistance from junction to ambient on P.C. Board Mounted
1
RATINGS AND CHARACTERISTIC CURVES
2


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